Wafer saw cut semiconductor wafer into small die using mechanical dicing saw. The Loadpoint MicroAce 66 wafer saw is a 150mm capable dicing saw with Off-chuck contact height sensing, which allow use of conductive and non-conductive blades. It has a built in PC control with flexible programming for automatic and safe dicing. It has a high resolution camera and display for inspection and alignment. It can cut thick material down to 10 mm with depth cutting resolution of 0.01 micron, and edge cut resolution better that 5 microns. Materials that can be diced include Si, GaAs, ceramic, glass, quartz, PCB, PZT, Cu, Tungsten carbide, stainless steel, lithiumniobate etc.





Academic Contact

Prof Prof Edmund Linfield

Technical Contact

Dr Dr Li Chen