Sputter deposition is a physical vapor deposition method to deposite thin films onto a substrate by sputtering material from a target source. Inert gas such as argon is normally used to generate plasma, which strikes on target source causing sputtered atoms and ions ejected from the solid state target to travel through vacuum and collide with the substrate leading to condensation into thin film. Pure material as well as compound film can be formed. Kurt J Lesker PVD 75 sputter system can coat the following materials: Au, Ti, Cr,Al, ZnO, Mo, SiO2. Base pressure is 2×10-6mBar.