The wedge bonder can make interconnections between a semiconductor device and a bonding chip package using heat, pressure and ultrasonic energy. Aluminium and gold wires are commonly used to assemble semiconductor packages. The Kulicke & Soffa model 4123 Wedge bonder can provide ultrasonic power up to 2.0 W to generate heat up to 150°C within bonding time typically ranging from 10 to 100 ms. Gold wire can range from 12-75 microns in diameter, and aluminium wire can range from 25 – 75 microns in diameter. Bonding area is limited in 95 mm × 95 mm.

ManufacturerKULICKE & SOFFA




Academic Contact

Prof Prof Edmund Linfield

Technical Contact

Dr Dr Li Chen